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| EMIF06-MSD01F2 IPADTM Mini and micro SD Card - EMI filtering and 25 kV ESD protection Main application Mini and micro (T-Flash) Secure Digital memory card in mobile phones and communication systems Description The EMIF06-MSD01F2 is a highly integrated device based on IPAD technology with the following functions: ESD protection to comply with IEC standard EMI Filtering to reject mobile phone frequencies Flip-Chip (16 Bumps) Pin configuration (bump side) 4 A B C D 3 2 1 Benefits EMI Low-pass-filter ESD protection 25 kV (IEC 61000-4-2) Integrated pull up resistors to prevent bus floating when no card is connected 50 Mhz clock frequency compatibility with Cline< 20 pF Low power consumption Easy Layout thanks to smart pin-out configuration Very low PCB space consuming High reliability offered by monolithic integration Reduction of parasitic elements thanks to CSP integration Lead free package Coated version option upon request A1 A2 A3 A4 B1 B2 B3 B4 DATA0 DATA1 SDDATA1 SDDATA0 CLK Vcc Vss SDCLK C1 C2 C3 C4 D1 D2 D3 D4 CMD Vss Vss SDCMD DATA3/CD DATA2 SDDATA2 SDDATA3/CD Complies with the following standards: IEC 61000-4-2 level 4 15 kV (air discharge) 8 kV (contact discharge) MIL STD 883G - Method 3015-7 Class 3A SD Card Specification Ver. 1.01 MicroSD Card Specification Ver. 1.0 Physical layer specification, Part 1 vesion 1.1 Order code Part Number EMIF06-MSD01F2 Marking HJ TM: IPAD is a trademeark of STMicroelectronics February 2007 Rev 1 1/7 www.st.com 7 Characteristics EMIF06-MSD01F2 1 Characteristics Table 1. Symbol VPP Vin Tj Top Tstg Absolute ratings (limiting values) Parameter and test conditions ESD discharge IEC 61000-4-2, air discharge ESD discharge IEC 61000-4-2, contact discharge Maximum input voltage Maximum junction temperature Operating temperature range Storage temperature range Value 25 25 5.5 125 - 40 to + 85 125 Unit kV V C C C Figure 1. EMIF06-MSD01F2 configuration Vcc R9 R10 R11 R12 R13 R1 Host Clk CMD Data0 Data1 Data2 Data3/CD R2 R3 R4 R5 R6 SDClk SDCMD SDData0 SDData1 SDData2 SDData3/CD Card Vss Vss Table 2. Electrical characteristics Symbol VBR IRM IR = 1 mA VRM = 3 V Tolerance 20% Tolerance 30% V = 0 V, F = 1 MHz Vosc = 30 mV 40 25 17 20 Test conditions Min. 14 Typ. 16 0.1 Max. Unit V A k pF R1, R2, R3, R4, R5, R6 R9, R10, R11, R12, R13 Cline 2/7 EMIF06-MSD01F2 Characteristics Figure 2. dB Frequency response for line D3/D2 - VCC not connected Figure 3. dB 0.00 -10.00 Frequency response for line C1/B4 - VCC not connected 0.00 -10.00 -20.00 -20.00 -30.00 -40.00 -30.00 -50.00 -60.00 -40.00 -70.00 F (Hz) -50.00 1.0M 3.0M D2-D3 10.0M 30.0M 100.0M 300.0M 1.0G 3.0G -80.00 1.0M 3.0M C1-B4 10.0M F (Hz) 30.0M 100.0M 300.0M 1.0G 3.0G Figure 4. ESD response to IEC 61000-4-2 (+15 kV air discharge) on one imput (Vin) and one output (Vout) Figure 5. ESD response to IEC 61000-4-2 (-15 kV air discharge) on one imput (Vin) and one output (Vout) Figure 6. Junction capacitance versus reverse applied voltage CLK line (typical values) 14 12 10 8 6 4 2 0 CLINE (pF) VLINE (V) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 3/7 Technical information EMIF06-MSD01F2 2 Technical information Figure 7. T-Flash connection diagram recommendation (MicroSD Specification Ver 1.0) RDAT RCMD CMD DAT0~3 CLK EMIF06-MSD01F2 HOST C 1 C2 C3 Pin Pin Pin Pin Pin Pin Pin Pin 1 2 3 4 5 6 7 8 Pull-up resistance RDAT and RCMD are implemented to prevent bus floating when no card is inserted or when all card drivers are in high impedance mode. Resistance values should be set between 10 k and 100 k . The pull-up resistors and capacitors described in the above recommendation are integrated in the EMIF06-MSD01F2. This makes the EMIF06-MSD01F2 an easy "plug and play" solution to implement secured T-flash, mini-SD card terminations. Figure 8. Layout recommendation DAT1 DAT0 VSS DAT1 CLK DAT0 CLK CMD NC DAT3/CD VSS DAT2 Input Top level Second level DAT2 Output CMD DAT3/CD VCC NC Top View GND 4/7 EMIF06-MSD01F2 Ordering information scheme 3 Ordering information scheme EMIF EMI Filter Number of lines Information x = resistance value (Ohms) z = capacitance value / 10(pF) or 3 letters = application 2 digits = version Package F = Flip-Chip x = 2: Lead free Pitch = 500 m, Bump = 315 m yy - xxx zz Fx 4 Package information Figure 9. Flip-Chip Package dimensions 500 m 50 315 m 50 650 m 65 500 m 50 1.92 mm 50 m Figure 10. Foot print recommendations Figure 11. Marking Copper pad Diameter: 250 m recommended , 300 m max 1.92 mm 50 m Dot, ST logo xx = marking z = manufacturing location yww = datecode (y = year ww = week) E Solder stencil opening: 330 m Solder mask opening recommendation: 340 m min for 300 m copper pad diameter xxz yww 5/7 Ordering information Figure 12. Flip-Chip Tape and reel specification Dot identifying Pin A1 location 4 +/- 0.1 EMIF06-MSD01F2 O 1.5 +/- 0.1 1.75 +/- 0.1 3.5 +/- 0.1 0.73 +/- 0.05 All dimensions in mm In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Note: More packing information is available in the application notes: AN1235: "Flip-Chip: Package description and recommendations for use" AN1751: "EMI Filters: Recommendations and measurements" 8 +/- 0.3 STE STE STE xxz yww User direction of unreeling xxz yww xxz yww 4 +/- 0.1 5 Ordering information Ordering code EMIF06-MSD01F2 Marking HJ Package Flip-Chip Weight 5.3 mg Base qty 5000 Delivery mode Tape and reel 7" 6 Revision history Date 02-Feb-2007 Revision 1 First issue. Description of Changes 6/7 EMIF06-MSD01F2 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2007 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 7/7 |
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